Invention Grant
- Patent Title: Method and system for manufacturing a semiconductor package structure
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Application No.: US18089458Application Date: 2022-12-27
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Publication No.: US12183712B2Publication Date: 2024-12-31
- Inventor: Che-Ting Liu , Jheng-Yu Hong , Yu-Ting Lu , Po-Chun Lee , Chih-Hsiang Hsu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/67 ; H01L21/683 ; H01L21/78 ; H01L23/00 ; H01L23/544
Abstract:
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
Public/Granted literature
- US20230138460A1 METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2023-05-04
Information query
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