公开(公告)号：US12183712B2

公开(公告)日：2024-12-31

申请号：US18089458

申请日：2022-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting Liu ,  Jheng-Yu Hong ,  Yu-Ting Lu ,  Po-Chun Lee ,  Chih-Hsiang Hsu

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/544

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

公开(公告)号：US11538787B2

公开(公告)日：2022-12-27

申请号：US17086179

申请日：2020-10-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Che-Ting Liu ,  Jheng-Yu Hong ,  Yu-Ting Lu ,  Po-Chun Lee ,  Chih-Hsiang Hsu

IPC: H01L21/56 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L23/544 ,  H01L21/67

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).