Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having removed substrate
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Application No.: US16727406Application Date: 2019-12-26
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Publication No.: US12199143B2Publication Date: 2025-01-14
- Inventor: Biswajeet Guha , Mauro Kobrinsky , Patrick Morrow , Oleg Golonzka , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/027 ; H01L21/306 ; H01L21/84 ; H01L27/12 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
Gate-all-around integrated circuit structures having a removed substrate, and methods of fabricating gate-all-around integrated circuit structures having a removed substrate, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires. A gate stack surrounds a channel region of the vertical arrangement of horizontal nanowires. A pair of non-discrete epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal nanowires. A pair of dielectric spacers is between the pair of non-discrete epitaxial source or drain structures and the gate stack. The pair of dielectric spacers and the gate stack have co-planar top surfaces. The pair of dielectric spacers, the gate stack and the pair of non-discrete epitaxial source or drain structures have co-planar bottom surfaces.
Public/Granted literature
- US20210202696A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING REMOVED SUBSTRATE Public/Granted day:2021-07-01
Information query
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