Invention Grant
- Patent Title: Application device for applying adhesive, and adhesive application method
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Application No.: US17968751Application Date: 2022-10-18
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Publication No.: US12202002B2Publication Date: 2025-01-21
- Inventor: Akira Homma
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: NHK SPRING CO., LTD.
- Current Assignee: NHK SPRING CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2020-045382 20200316
- Main IPC: B05D5/10
- IPC: B05D5/10 ; B05C5/02 ; B05C11/10 ; H05K13/04 ; B05C1/04

Abstract:
An application method for applying an adhesive to an object includes applying, prior to applying the adhesive to a specified part of the object, the adhesive to a part different from the specified part, calculating an application quantity of the adhesive applied to the part different from the specified part, making a first correction configured to correct an application condition of the adhesive based on basis of a result of the calculation, and applying the adhesive to the specified part using the application condition corrected in the first correction.
Public/Granted literature
- US20230042593A1 APPLICATION DEVICE FOR APPLYING ADHESIVE, AND ADHESIVE APPLICATION METHOD Public/Granted day:2023-02-09
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