公开(公告)号：US12202002B2

公开(公告)日：2025-01-21

申请号：US17968751

申请日：2022-10-18

Applicant: NHK SPRING CO., LTD.

Inventor： Akira Homma

IPC: B05D5/10 ,  B05C5/02 ,  B05C11/10 ,  H05K13/04 ,  B05C1/04

Abstract: An application method for applying an adhesive to an object includes applying, prior to applying the adhesive to a specified part of the object, the adhesive to a part different from the specified part, calculating an application quantity of the adhesive applied to the part different from the specified part, making a first correction configured to correct an application condition of the adhesive based on basis of a result of the calculation, and applying the adhesive to the specified part using the application condition corrected in the first correction.

公开(公告)号：US11998943B2

公开(公告)日：2024-06-04

申请号：US17200712

申请日：2021-03-12

Applicant: NHK SPRING CO., LTD.

Inventor： Akira Homma

IPC: B05C11/10 ,  B05C5/02 ,  B05D5/10 ,  B05C1/04 ,  H05K13/04

CPC classification number: B05C11/1005 ,  B05C5/0212 ,  B05C11/1013 ,  B05D5/10 ,  B05C1/04 ,  B05C5/0216 ,  H05K13/0469 ,  Y10T156/1798

Abstract: An application method of an application device configured to apply an adhesive to an object. The method includes applying, prior to applying the adhesive to a specified part of the object, the adhesive to a part different from the specified part, calculating an application quantity of the adhesive applied to the part different from the specified part, making a first correction configured to correct an application condition of the adhesive based on a result of the calculation, and applying the adhesive to the specified part using the application condition corrected in the first correction.