Invention Grant
- Patent Title: Resin sheet
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Application No.: US17792615Application Date: 2021-01-15
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Publication No.: US12247124B2Publication Date: 2025-03-11
- Inventor: Yasutaka Watanabe , Yasunori Karasawa , Kazue Uemura
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Rimon P.C.
- Priority: JP2020-005184 20200116,JP2020-126347 20200727
- International Application: PCT/JP2021/001207 WO 20210115
- International Announcement: WO2021/145416 WO 20210722
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08G8/10 ; C08G73/12 ; C08J5/18 ; C08K3/22 ; C08K3/38 ; C08K5/3492 ; C09D179/08 ; H01L23/29 ; H01L23/31 ; H05K1/03

Abstract:
A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10−6 m2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet, 0.25≤Ld/Lt≤1 (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.
Public/Granted literature
- US20230090587A1 RESIN SHEET Public/Granted day:2023-03-23
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