公开(公告)号：US12247124B2

公开(公告)日：2025-03-11

申请号：US17792615

申请日：2021-01-15

Applicant: LINTEC CORPORATION

Inventor： Yasutaka Watanabe ,  Yasunori Karasawa ,  Kazue Uemura

IPC: C08L79/08 ,  C08G8/10 ,  C08G73/12 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08K5/3492 ,  C09D179/08 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10−6 m2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet, 0.25≤Ld/Lt≤1  (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.

公开(公告)号：US11512200B2

公开(公告)日：2022-11-29

申请号：US16494215

申请日：2017-08-31

Applicant: LINTEC CORPORATION

Inventor： Yasunori Karasawa

IPC: B32B27/28 ,  B32B7/06 ,  H01L23/29 ,  C09J179/08 ,  C09J171/10 ,  C09J7/40 ,  C09J7/30 ,  C08L79/08 ,  C08L71/10 ,  C08K3/36 ,  C08L71/12 ,  C08K3/22

Abstract: A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.