Invention Grant
- Patent Title: Method and apparatus for controlled ion implantation
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Application No.: US17560529Application Date: 2021-12-23
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Publication No.: US12247283B2Publication Date: 2025-03-11
- Inventor: Alexander K. Eidukonis , Hans-Joachim L. Gossmann , Dennis Rodier , Stanislav S. Todorov , Richard White , Wei Zhao , Wei Zou , Supakit Charnvanichborikarn
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: KDW FIRM PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; C23C14/48 ; C23C14/54 ; H01J37/304 ; H01J37/317

Abstract:
A method of operating a beamline ion implanter may include performing, in an ion implanter, a first implant procedure to implant a dopant of a first polarity into a given semiconductor substrate, and generating an estimated implant dose of the dopant of the first polarity based upon a set of filtered information, generated by the first implant procedure. The method may also include calculating an actual implant dose of the dopant of the first polarity using a predictive model based upon the estimated implant dose, and performing, in the ion implanter, an adjusted second implant procedure to implant a dopant of a second polarity into a select semiconductor substrate, based upon the actual implant dose.
Public/Granted literature
- US20230016122A1 METHOD AND APPARATUS FOR CONTROLLED ION IMPLANTATION Public/Granted day:2023-01-19
Information query
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