Invention Grant
- Patent Title: Apparatus for heating substrate and method thereof
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Application No.: US17446667Application Date: 2021-09-01
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Publication No.: US12256471B2Publication Date: 2025-03-18
- Inventor: Takahisa Mase
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP2020-151978 20200910
- Main IPC: H05B1/02
- IPC: H05B1/02 ; C23C16/46 ; C23C16/52 ; G05D23/19 ; G05D23/24 ; H05B3/22

Abstract:
An apparatus for heating a substrate includes: a stage including at least one resistance heater that heats the substrate placed thereon; a temperature detector for detecting a heating temperature of the substrate; a temperature calculator for calculating the heating temperature based on a resistance value of the at least one resistance heater; a power controller for performing a power control with respect to a first power to be supplied to the at least one resistance heater such that the heating temperature becomes close to a first preset temperature by switchably applying a phase control and a zero-cross control; and a controller for switching the power control of the power controller to the phase control or the zero-cross control.
Public/Granted literature
- US20220078888A1 APPARATUS FOR HEATING SUBSTRATE AND METHOD THEREOF Public/Granted day:2022-03-10
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