公开(公告)号：US12256471B2

公开(公告)日：2025-03-18

申请号：US17446667

申请日：2021-09-01

Applicant: Tokyo Electron Limited

Inventor： Takahisa Mase

IPC: H05B1/02 ,  C23C16/46 ,  C23C16/52 ,  G05D23/19 ,  G05D23/24 ,  H05B3/22

Abstract: An apparatus for heating a substrate includes: a stage including at least one resistance heater that heats the substrate placed thereon; a temperature detector for detecting a heating temperature of the substrate; a temperature calculator for calculating the heating temperature based on a resistance value of the at least one resistance heater; a power controller for performing a power control with respect to a first power to be supplied to the at least one resistance heater such that the heating temperature becomes close to a first preset temperature by switchably applying a phase control and a zero-cross control; and a controller for switching the power control of the power controller to the phase control or the zero-cross control.

公开(公告)号：US11488847B2

公开(公告)日：2022-11-01

申请号：US16919464

申请日：2020-07-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki Miyashita ,  Shohei Yoshida ,  Takahisa Mase

IPC: H01L21/67 ,  F27B17/00 ,  H01L21/66 ,  H01L21/324

Abstract: An apparatus for heat-treating a substrate includes: a stage where the substrate is disposed; a heating part configured to change an output; a first temperature measurement part configured to measure a temperature at which the substrate is heated; a second temperature measurement part configured to measure the temperature, and having a level of measurement accuracy which is lower than that of the first temperature measurement part in a first temperature region and is higher than that of the first temperature measurement part in a second temperature region; a temperature calculator configured to calculate a weighted average temperature of the temperatures measured by the first and second temperature measurement parts if a reference temperature is in a temperature range between the first and second temperatures, and configured to change a weight of the weighted average temperature; and a controller configured to control the output based on the weighted average temperature.

公开(公告)号：US11774298B2

公开(公告)日：2023-10-03

申请号：US16789046

申请日：2020-02-12

Applicant: Tokyo Electron Limited

Inventor： Melvin Verbaas ,  Kentaro Asakura ,  Takashi Mochizuki ,  Takahisa Mase ,  Nobutaka Yoshioka ,  Saki Matsuo

IPC: G01K7/02 ,  H05B3/26 ,  H05B3/14 ,  G01K1/08 ,  H01L21/67 ,  G01K1/14 ,  G01K1/16 ,  H01L21/687

CPC classification number: G01K7/02 ,  G01K1/08 ,  G01K1/14 ,  G01K1/16 ,  H01L21/67098 ,  H05B3/141 ,  H05B3/265 ,  H01L21/67103 ,  H01L21/68785

Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.

公开(公告)号：US20210247240A1

公开(公告)日：2021-08-12

申请号：US16789046

申请日：2020-02-12

Applicant: Tokyo Electron Limited

Inventor： Melvin Verbaas ,  Kentaro Asakura ,  Takashi Mochizuki ,  Takahisa Mase ,  Nobutaka Yoshioka ,  Saki Matsuo

IPC: G01K7/02 ,  G01K1/08 ,  H05B3/14 ,  H05B3/26 ,  H01L21/67

Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.