Thermal management in integrated circuit packages

Invention Grant

US12261097B2 Thermal management in integrated circuit packages 有权

Patent Title: Thermal management in integrated circuit packages
Application No.: US18366734

Application Date: 2023-08-08
Publication No.: US12261097B2

Publication Date: 2025-03-25
Inventor: Feras Eid , Telesphor Kamgaing , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
Applicant: Intel Corporation
Applicant Address: US CA Santa Clara
Assignee: Intel Corporation
Current Assignee: Intel Corporation
Current Assignee Address: US CA Santa Clara
Agency: Akona IP PC
Main IPC: H01L23/427
IPC: H01L23/427 ; H01L23/31 ; H01L23/373 ; H01L23/38 ; H01L23/48 ; H01L23/66 ; H01L25/16 ; H03H9/46

Abstract:

Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/34	.冷却装置；加热装置；通风装置或温度补偿装置
H01L23/42	..为便于加热或冷却在容器里选择或配置的填料或辅助构件
H01L23/427	...通过物态改变而冷却的，例如使用热管