Invention Grant
- Patent Title: Memory module connector for thin computing systems
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Application No.: US17479596Application Date: 2021-09-20
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Publication No.: US12300918B2Publication Date: 2025-05-13
- Inventor: Navneet Kumar Singh , Aiswarya M. Pious , Richard S. Perry , Amarjeet Kumar , Siva Prasad Jangili Ganga , Gaurav Hada , Sushil Padmanabhan , Konika Ganguly
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R12/73 ; H01R43/26

Abstract:
A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.
Public/Granted literature
- US20220077609A1 MEMORY MODULE CONNECTOR FOR THIN COMPUTING SYSTEMS Public/Granted day:2022-03-10
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