Invention Application
- Patent Title: Carrier head with local pressure control for a chemical mechanical polishing apparatus
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Application No.: US10059519Application Date: 2002-01-28
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Publication No.: US20020072313A1Publication Date: 2002-06-13
- Inventor: Steven M. Zuniga , Hung Chih Chen , Manoocher Birang , Kapila Wijekoon , Sen-Hou Ko
- Applicant: Applied Materials, Inc., a Delaware corporation
- Applicant Address: null
- Assignee: Applied Materials, Inc., a Delaware corporation
- Current Assignee: Applied Materials, Inc., a Delaware corporation
- Current Assignee Address: null
- Main IPC: B24B005/00
- IPC: B24B005/00
Abstract:
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.
Public/Granted literature
- US06511367B2 Carrier head with local pressure control for a chemical mechanical polishing apparatus Public/Granted day:2003-01-28
Information query
