- 专利标题： Carrier head with local pressure control for a chemical mechanical polishing apparatus
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申请号： US10059519申请日： 2002-01-28
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公开(公告)号： US20020072313A1公开(公告)日： 2002-06-13
- 发明人: Steven M. Zuniga , Hung Chih Chen , Manoocher Birang , Kapila Wijekoon , Sen-Hou Ko
- 申请人： Applied Materials, Inc., a Delaware corporation
- 申请人地址： null
- 专利权人： Applied Materials, Inc., a Delaware corporation
- 当前专利权人： Applied Materials, Inc., a Delaware corporation
- 当前专利权人地址： null
- 主分类号： B24B005/00
- IPC分类号： B24B005/00
摘要：
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.
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