专利检索 ap:("Applied Materials, Inc., a Delaware corporation") AND inv:"Kapila Wijekoon" 第 1 页

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发明申请
Carrier head with local pressure control for a chemical mechanical polishing apparatus 有权

公开(公告)号：US20020072313A1

公开(公告)日：2002-06-13

申请号：US10059519

申请日：2002-01-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga , Hung Chih Chen , Manoocher Birang , Kapila Wijekoon , Sen-Hou Ko

IPC分类号： B24B005/00

CPC分类号： B24B37/30 , B24B37/32 , B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.