公开(公告)号：US20020164938A1

公开(公告)日：2002-11-07

申请号：US10187143

申请日：2002-06-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： B24B005/00 ,  B24B029/00 ,  B24B047/02 ,  B24B041/06

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.

摘要翻译： 一种可拆卸地固定在承载头中刚性结构表面的可压缩膜。 可压缩膜具有多个孔，其定位成在抛光期间在基板上产生不均匀的压力分布，以便提高抛光均匀性。 孔可以间隔开并定位成在衬底上提供局部均匀但全局不均匀的压力分布。

公开(公告)号：US20020072313A1

公开(公告)日：2002-06-13

申请号：US10059519

申请日：2002-01-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B005/00

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

公开(公告)号：US20040209556A1

公开(公告)日：2004-10-21

申请号：US10826185

申请日：2004-04-15

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Thomas H. Osterheld ,  Lawrence M. Rosenberg

IPC分类号： B24B001/00

CPC分类号： B24B41/06 ,  B24B37/30 ,  B24B37/32

摘要： A substrate is maintained beneath a substrate mounting surface with a retaining ring that includes a generally annular lower portion having a bottom surface for contacting the polishing surface during polishing, and a generally annular upper portion having a bottom surface joined to the lower portion and a top surface fixed to and abutting the base. The lower portion is made of a plastic and the upper lower portion is made of a metal which is more rigid than the plastic.

摘要翻译： 衬底被保持在衬底安装表面下方，其具有保持环，保持环包括大体上环形的下部，其具有用于在抛光期间接触抛光表面的底表面，以及大致环形的上部，其具有连接到下部的底面， 表面固定到基座上并邻接基座。 下部由塑料制成，上部的上部由比塑料更硬的金属制成。

公开(公告)号：US20040033769A1

公开(公告)日：2004-02-19

申请号：US10353326

申请日：2003-01-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B005/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

摘要翻译： 用于化学机械抛光装置的载体头。 承载头包括壳体，基座，装载机构，万向节机构和基底背衬组件。 衬底背衬组件包括位于底座下方的支撑结构，将支撑结构连接到基座的基本水平的环形弯曲部，以及连接到支撑结构的柔性膜。 柔性膜具有用于基底的安装表面，并且在基底之下延伸以限定腔室。

公开(公告)号：US20020086624A1

公开(公告)日：2002-07-04

申请号：US10071745

申请日：2002-02-08

申请人： Applied Materials, Inc. a Delaware corporation

发明人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B001/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

公开(公告)号：US20020179251A1

公开(公告)日：2002-12-05

申请号：US10199738

申请日：2002-07-18

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Hung Chih Chen

IPC分类号： C23F001/02 ,  B28B001/00 ,  B32B013/00

CPC分类号： B24B37/32 ,  B24B37/28

摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.