Invention Application
- Patent Title: Plating bath analysis
- Patent Title (中): 电镀浴分析
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Application No.: US10002039Application Date: 2001-11-02
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Publication No.: US20020074244A1Publication Date: 2002-06-20
- Inventor: Wade Sonnenberg , Mark J. Kapeckas , David L. Jacques , Raymond Cruz , Leon R. Barstad , Elie H. Najjar , Eugene N. Step , Robert A. Binstead
- Applicant: Shipley Company, L.L.C.
- Applicant Address: MA Marlborough
- Assignee: Shipley Company, L.L.C.
- Current Assignee: Shipley Company, L.L.C.
- Current Assignee Address: MA Marlborough
- Main IPC: G01N027/48
- IPC: G01N027/48

Abstract:
Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
Public/Granted literature
- US06827839B2 Plating bath analysis Public/Granted day:2004-12-07
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