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公开(公告)号：US20030085132A1
公开(公告)日：2003-05-08
申请号：US09970271
申请日：2001-10-02
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25C007/00 , C25B009/00 , C25D017/00 , C25D003/00 , C25D003/54 , C25D003/46 , C25D003/50 , C25D003/48
摘要： A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
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公开(公告)号：US20040206631A1
公开(公告)日：2004-10-21
申请号：US09970171
申请日：2001-10-02
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D003/38
摘要： A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的有机化合物的金属镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的有机化合物可增加电镀液的使用寿命，提高电镀工艺的效率。 含有抑制或延迟添加剂消耗的有机化合物的电镀液可以用于铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US20020074244A1
公开(公告)日：2002-06-20
申请号：US10002039
申请日：2001-11-02
发明人： Wade Sonnenberg , Mark J. Kapeckas , David L. Jacques , Raymond Cruz , Leon R. Barstad , Elie H. Najjar , Eugene N. Step , Robert A. Binstead
IPC分类号： G01N027/48
摘要： Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
摘要翻译： 公开了用于在存在其它有机添加剂如加速剂，增白剂和抑制剂的情况下确定电镀浴中的矫光机的量的方法。 这样的方法是快速的，在广泛的组分范围内工作，并且可以实时地执行。
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公开(公告)号：US20040104124A1
公开(公告)日：2004-06-03
申请号：US10720647
申请日：2003-11-24
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D003/38 , C09D005/00
摘要： A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as ductility, micro-throwing power and micro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
摘要翻译： 金属电镀浴和金属镀层的方法，其中金属电镀浴含有预防或抑制金属电镀浴添加剂消耗的杂原子有机化合物。 金属电镀浴添加剂提高镀金的亮度以及电镀液的延展性，微投能力和微投能力。 添加消耗抑制杂原子有机化合物的添加改善了电镀金属的物理性能以及电镀工艺的效率。 杂原子有机化合物可以含有硫，氧或氮杂原子。
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公开(公告)号：US20030070934A1
公开(公告)日：2003-04-17
申请号：US09970348
申请日：2001-10-02
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： B05B001/00 , C23C016/00 , C09D005/00 , B22F007/00
摘要： A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
摘要翻译： 金属电镀浴和金属镀金属的方法，其中金属电镀浴含有防止或抑制金属电镀浴添加剂消耗的杂原子化合物。 金属电镀浴添加剂可以提高电镀金属的亮度，以及镀浴的延展性，微投能力和抛光力。 添加消耗抑制杂原子有机化合物的添加改善了电镀金属的物理性能以及电镀工艺的效率。 杂原子有机化合物可以含有硫，氧或氮杂原子。
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公开(公告)号：US20040074778A1
公开(公告)日：2004-04-22
申请号：US10684148
申请日：2003-10-10
发明人： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC分类号： C25D003/00
摘要： A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
摘要翻译： 金属镀液和金属电镀工艺，含有醛类化合物，可防止或减少金属电镀浴添加剂的消耗。 金属电镀浴提供有效的电镀方法，因为不需要中断电镀工艺以补充镀液。 金属电镀液可用于镀铜，金，银，钯，铂，钴，铬，镉，铋，铟，铑，铱和钌等金属。
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公开(公告)号：US20030102226A1
公开(公告)日：2003-06-05
申请号：US09970224
申请日：2001-10-02
发明人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC分类号： B05B001/00 , C09D005/00 , C09D005/10 , B22F007/00 , C23C016/00
摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US20030066756A1
公开(公告)日：2003-04-10
申请号：US09971300
申请日：2001-10-04
发明人： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC分类号： C25D003/56 , C25D003/60 , C25D003/58 , C25D003/62 , C25D003/00 , C25D003/46 , C25D003/50 , C25D003/48 , C25D003/12 , C25D003/26 , C25D003/10 , C25D003/38
摘要： A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.
摘要翻译： 一种金属电镀浴和在基板上镀金属的方法。 金属镀浴含有抑制添加剂浴组分消耗的羟胺，以提高金属电镀工艺的效率。 将添加剂浴组分添加到金属电镀浴中以改善电镀金属的亮度以及镀液的微投掷和投掷抛光力。 除了增白剂之外，添加剂浴组分可以包括矫平剂，抑制剂，硬化剂等。 抑制添加剂消耗的羟胺可以用于镀铜，金，银，铂，钯，钴，镉，镍，铋，铟，锡，铑，铱，钌及其合金的金属电镀浴中。
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9.发明申请Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US20020110645A1
公开(公告)日：2002-08-15
申请号：US09998117
申请日：2001-11-30
IPC分类号： B05D005/12 , B05D001/36 , B05D003/10
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
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