公开(公告)号：US20040089538A1

公开(公告)日：2004-05-13

申请号：US10455558

申请日：2003-06-05

Applicant: Shipley Company, L.L.C.

Inventor： Robert A. Binstead ,  Osnat Younes-Metzler ,  David A. Valeri ,  Robert D. Mikkola

IPC: C25B011/02

CPC classification number: C25D21/12 ,  G01N27/30

Abstract: A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.

Abstract translation: 一种用于电化学电池的对电极，适用于电镀组合物的分析，所述对电极包括导体; 围绕导体设置的护套; 设置在护套内的电解质; 和护套上的可选多孔的元件，多孔元件提供电解质和分析物之间的信号连通。

公开(公告)号：US20020074244A1

公开(公告)日：2002-06-20

申请号：US10002039

申请日：2001-11-02

Applicant: Shipley Company, L.L.C.

Inventor： Wade Sonnenberg ,  Mark J. Kapeckas ,  David L. Jacques ,  Raymond Cruz ,  Leon R. Barstad ,  Elie H. Najjar ,  Eugene N. Step ,  Robert A. Binstead

IPC: G01N027/48

CPC classification number: G01N27/42 ,  C25D21/12

Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Abstract translation: 公开了用于在存在其它有机添加剂如加速剂，增白剂和抑制剂的情况下确定电镀浴中的矫光机的量的方法。 这样的方法是快速的，在广泛的组分范围内工作，并且可以实时地执行。

公开(公告)号：US20020060157A1

公开(公告)日：2002-05-23

申请号：US10046507

申请日：2001-10-19

Applicant: Shipley Company, L.L.C.

Inventor： Jeffrey M. Calvert ,  Robert A. Binstead

IPC: C25D005/00 ,  C25D021/12 ,  C25C007/00 ,  C25D017/00

CPC classification number: C25D21/14 ,  C25D21/12 ,  Y10T436/24

Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Abstract translation: 公开了一种分析电镀浴中的组分的方法。 还公开了通过实时监测电镀液的成分来控制电镀槽的方法。

公开(公告)号：US20030205476A1

公开(公告)日：2003-11-06

申请号：US10457277

申请日：2003-06-09

Applicant: Shipley Company, L.L.C.

Inventor： Jeffrey M. Calvert ,  Robert A. Binstead

IPC: C25D021/12

CPC classification number: C25D21/14 ,  C25D21/12 ,  Y10T436/24

Abstract: Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Abstract translation: 公开了一种分析电镀浴中的有机成分的方法。 还公开了通过实时监测电镀液的成分来控制电镀槽的方法。