公开(公告)号：US20040040852A1

公开(公告)日：2004-03-04

申请号：US10620916

申请日：2003-07-16

Applicant: Shipley Company, L.L.C.

Inventor： Maria Anna Rzeznik ,  David L. Jacques

IPC: C25D005/54

CPC classification number: H05K3/244 ,  C23C18/42

Abstract: The present invention provides compositions and methods for immersion depositing highly adherent silver layers. The compositions contain silver ions, water and a carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Abstract translation: 本发明提供用于浸渍沉积高粘附性银层的组合物和方法。 组合物含有银离子，水和羧酸取代的含氮杂环化合物。 这样的组合物和方法在电子设备的制造中特别有用。

公开(公告)号：US20030128496A1

公开(公告)日：2003-07-10

申请号：US10268270

申请日：2002-10-10

Applicant: Shipley Company, L.L.C.

Inventor： Craig S. Allen ,  Maria Anna Rzeznik ,  David L. Jacques

IPC: H01G004/228

CPC classification number: H01G4/06 ,  H05K1/162 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0236 ,  H05K2201/0355 ,  H05K2203/0773

Abstract: Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 提供特别适用于电容器并具有纹理表面的电介质结构以及形成这些结构的方法。 这种介电结构显示随后施加的导电层的附着力增加。

公开(公告)号：US20020074244A1

公开(公告)日：2002-06-20

申请号：US10002039

申请日：2001-11-02

Applicant: Shipley Company, L.L.C.

Inventor： Wade Sonnenberg ,  Mark J. Kapeckas ,  David L. Jacques ,  Raymond Cruz ,  Leon R. Barstad ,  Elie H. Najjar ,  Eugene N. Step ,  Robert A. Binstead

IPC: G01N027/48

CPC classification number: G01N27/42 ,  C25D21/12

Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Abstract translation: 公开了用于在存在其它有机添加剂如加速剂，增白剂和抑制剂的情况下确定电镀浴中的矫光机的量的方法。 这样的方法是快速的，在广泛的组分范围内工作，并且可以实时地执行。

公开(公告)号：US20040043159A1

公开(公告)日：2004-03-04

申请号：US10620951

申请日：2003-07-16

Applicant: Shipley Company, L.L.C.

Inventor： Maria Anna Rzeznik ,  David L. Jacques

IPC: B05D001/18

CPC classification number: H05K3/244 ,  C23C18/42

Abstract: The present invention provides compositions and methods for electroless deposition of bright silver layers of uniform thickness. The compositions contain silver ions, water, one or more complexing agents and one or more carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Abstract translation: 本发明提供了均匀厚度的亮银层的无电沉积的组合物和方法。 组合物含有银离子，水，一种或多种络合剂和一种或多种羧酸取代的含氮杂环化合物。 这样的组合物和方法在电子设备的制造中特别有用。

公开(公告)号：US20030000846A1

公开(公告)日：2003-01-02

申请号：US10139085

申请日：2002-05-04

Applicant: Shipley Company, L.L.C.

Inventor： Maria Anna Rzeznik ,  David L. Jacques

IPC: C25D003/00 ,  C25D003/46

CPC classification number: H05K3/244 ,  C23C18/1637 ,  C23C18/1834 ,  C23C18/42 ,  C23C18/54

Abstract: The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Abstract translation: 本发明公开了用于增加浸渍镀浴中沉积的银层的粘附性的组合物，以及增加使用这些组合物获得的银层的粘附性的方法。 这样的组合物和方法在电子设备的制造中特别有用。