发明申请
US20030015707A1 Integrated radio frequency , optical, photonic, analog and digital functions in a semiconductor structure and method for fabricating semiconductor structure utilizing the formation of a compliant substrate for materials used to form the same 审中-公开
在半导体结构中的集成射频,光学,光子,模拟和数字功能以及用于制造半导体结构的方法,其利用用于形成相同材料的材料形成柔性衬底

  • 专利标题: Integrated radio frequency , optical, photonic, analog and digital functions in a semiconductor structure and method for fabricating semiconductor structure utilizing the formation of a compliant substrate for materials used to form the same
  • 专利标题(中): 在半导体结构中的集成射频,光学,光子,模拟和数字功能以及用于制造半导体结构的方法,其利用用于形成相同材料的材料形成柔性衬底
  • 申请号: US09905869
    申请日: 2001-07-17
  • 公开(公告)号: US20030015707A1
    公开(公告)日: 2003-01-23
  • 发明人: Bruce Allen BoscoRudy M. EmrickSteven James FransonNestor Javier EscaleraBryan K. Farber
  • 申请人: MOTOROLA, INC.
  • 申请人地址: US IL Schaumburg
  • 专利权人: MOTOROLA, INC.
  • 当前专利权人: MOTOROLA, INC.
  • 当前专利权人地址: US IL Schaumburg
  • 主分类号: H01L029/04
  • IPC分类号: H01L029/04
Integrated radio frequency , optical, photonic, analog and digital functions in a semiconductor structure and method for fabricating semiconductor structure utilizing the formation of a compliant substrate for materials used to form the same
摘要:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Radio frequency, optical, logic and other circuits in both silicon and compound semiconductor materials may be combined and interconnected in a single semiconductor structure.
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