摘要:
An electronic device includes a die further having a first major surface, and a second major surface. The electronic device also includes a plurality of connectors associated with the first major surface of the die, and an integrated heat spreader in thermally conductive relation with the second major surface of the die. The integrated heat spreader also has a layer of silicon, and a layer of diamond attached to the layer of silicon. The first major surface of the die attached to a printed circuit board. A method for forming a heat dissipating device includes placing a layer of diamond on a silicon substrate, and thinning the silicon substrate. The substrate is diced to form a plurality of heat dissipating devices sized to form a thermally conductive connection to a die. A surface of the silicon substrate is placed in thermal communication with a source of heat.
摘要:
The present invention provides a method of manufacturing Group III nitride crystals that are of high quality, are manufactured highly efficiently, and are useful and usable as a substrate that is used in semiconductor manufacturing processes. The method of manufacturing Group III nitride crystals includes: forming a first layer made of a semiconductor that is expressed by a composition formula of AlsGatIn1-s-tN (where 0nullsnull1, 0nulltnull1, and snulltnull1); forming a second layer by bringing the surface of the first layer into contact with a melt in an atmosphere including nitrogen, wherein the second layer includes greater defects in a crystal structure, such as a dislocation density for example, than those of the first layer, and the melt includes alkali metal and at least one Group III element selected from the group consisting of gallium, aluminum, and indium; and forming a third layer through crystal growth in the melt in an atmosphere including nitrogen, wherein the third layer is made of a semiconductor that is expressed by a composition formula of AluGavIn1-u-vN (where 0nullunull1, 0nullvnull1, and unullvnull1), and the third layer has less defects in a crystal structure, such as a dislocation density for example, than those of the second layer.
摘要翻译:本发明提供一种制造高品质的III族氮化物晶体的方法,其制造高效率,并且可用和用作半导体制造工艺中使用的基板。 制造III族氮化物晶体的方法包括:形成由AlsGatIn1-s-tN的组成式表示的半导体制成的第一层(其中0≤s≤1,0<= t <= 1,和 s + t <= 1); 通过使第一层的表面在包括氮气的气氛中与熔体接触而形成第二层,其中第二层在诸如位错密度的晶体结构中具有比第一层更大的缺陷, 并且熔体包括碱金属和至少一种选自镓,铝和铟的III族元素; 并且在包括氮气的气氛中通过在熔体中的晶体生长形成第三层,其中第三层由以下组成式表示的半导体制成:AlluGavIn1-u-vN(其中0 <= u <= 1,0 <= v <= 1,u + v <= 1),并且第三层在诸如位错密度的晶体结构中具有比第二层更少的缺陷。
摘要:
A thin film transistor according to the present invention includes a gate electrode, a semiconductor layer having a channel forming region arranged on the gate electrode and an impurity region arranged on a part of the channel forming region, source and drain electrodes electrically connected to the impurity region, and a gate insulating film that electrically insulates the gate electrode and the semiconductor layer, wherein the distance between the upper end of the gate electrode and the upper end of the impurity region is larger than the distance between the upper end of the gate electrode and the upper end of the channel forming region.
摘要:
An object of the present invention is to provide an active matrix type display unit having a pixel structure in which a pixel electrode formed in a pixel portion a scanning line (gate line) and a data line are suitably arranged, and high numerical aperture is realized without increasing the number of masks and the number of processes. In this display unit, a first wiring arranged between a semiconductor film and a substrate through a first insulating film is overlapped with this semiconductor film and is used as a light interrupting film. Further, a second insulating film used as a gate insulating film is formed on the semiconductor film. A gate electrode and a second wiring are formed on the second insulating film. The first and second wirings cross each other through the first and second insulating films. A third insulating film is formed as an interlayer insulating film on the second wiring, and a pixel electrode is formed on this third insulating film. The pixel electrode can be overlapped with the first and second wirings so that an area of the pixel electrode can be increased in the display unit of a reflection type.
摘要:
A pinned photodiode for a CMOS image sensor and fabricating method thereof is disclosed. The disclosed pinned photodiode can reduce a probability of recombination of excess electrons by forming a second potential well having a center-cross form across a photodiode area. The disclosed pinned photodiode-fabricating method comprises forming a photodiode on a substrate, forming a first potential well between the substrate and the photodiode, and forming a second potential well having a center-cross form across said photodiode, which is positioned more deeply than said first potential well.
摘要:
A power device includes a semiconductor die having an upper surface and a lower surface. One or more terminals are coupled to the die. A first substrate is bonded to the upper surface of the die. The first substrate is configured to provide a first heat dissipation path. A second substrate is bonded to the lower surface of the die. The second substrate is configured to provide a second heat dissipation path.
摘要:
A thin-film transistor (TFT) with body contacts is disclosed. It is used in polysilicon TFT LCD's. A body contact region for separating the gate electrode, a source region, and a drain region is made in the TFT. Through the dopants in the body contact region and different impurities in the source region and the drain region, a body-trigger bias is imposed on the body of the TFT. This method reduces the threshold voltage of the TFT driving circuit, thereby increasing the driving current.
摘要:
A thin film transistor (TFT) structure includes a substrate, a polysilicon structure including a plurality of channel regions, at least one lightly doped region and at least one heavily doped source/drain region, a plurality of gate structures, and an insulating layer formed between the gate structures and the polysilicon structure. The thickness of a first portion of the insulating layer under and between the gate structures is greater than the thickness of a second portion of the insulating layer adjacent to the first portion. At least one lightly doped region is formed under the first portion of the insulating layer and at least one heavily doped source/drain region is formed under the second portion of the insulating layer via the same doping procedure.
摘要:
An EB curing process is performed on a photoresist (7), with an energy beam absorbing film (5) formed on a low dielectric constant interlayer insulator film (4). The energy beam absorbing film (5) contains a compound represented by the following general formula: 1 wherein at least one of X, Xnull, R and Rnull is selected from the group consisting of bromine, iodine, an alkyl bromide and an alkyl iodide, and n is a positive integer. The compound represented by the general formula absorbs an electron beam well to make it difficult for the electron beam to reach the low dielectric constant interlayer insulator film (4) to be patterned.
摘要:
In an image recognition apparatus and an LCD apparatus having the same, a plurality of gate lines arranged in a transparent substrate has a predetermined slope such that the gate lines intersect with two sides of the transparent substrate, which are adjacent to or facing each other. A plurality of sensing signal output line arranged in the transparent substrate is substantially perpendicular to the gate lines. An image recognition sensor is formed on a pixel area defined by the gate and sensing signal output lines adjacent to each other. The image recognition sensor senses an image pattern of an object in response to gate driving signals from the gate lines and outputs the sensed image pattern through the sensing signal output lines. Accordingly, the LCD apparatus may prevent appearance of the moire image and deterioration of the display quality of the LCD panel.