Invention Application
- Patent Title: Resistive element apparatus and method
- Patent Title (中): 电阻元件装置及方法
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Application No.: US09977124Application Date: 2001-10-12
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Publication No.: US20030072140A1Publication Date: 2003-04-17
- Inventor: Chee-Yee Chung , Robert L. Sankman , Alex Waizman
- Applicant: Intel Corporation
- Applicant Address: null
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: null
- Main IPC: H05K007/06
- IPC: H05K007/06 ; H05K003/30

Abstract:
A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point connected to a capacitor terminal, a second contact point connected to a circuit board plane, and resistive material connected to the first and second contact points. The invention may also include a circuit board with one or more resistive elements, as well as a circuit package, such as an integrated circuit or a discrete bypass capacitor, including one or more resistive elements, applied to an outside surface. The value of resistance for the resistive element can be selected by design to have a predetermined relationship with the equivalent resistance of an associated circuit board and connecting circuitry.
Public/Granted literature
- US07239524B2 Resistive element apparatus and method Public/Granted day:2007-07-03
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