公开(公告)号：US20040125517A1

公开(公告)日：2004-07-01

申请号：US10331944

申请日：2002-12-31

Applicant: INTEL CORPORATION

Inventor： Don J. Nguyen ,  Alex Waizman

IPC: H02H009/00

CPC classification number: G06F1/305 ,  Y10T307/549 ,  Y10T307/587

Abstract: Methods and systems of providing power to a central processing unit (CPU) provide for enhanced surge protection and increased battery life. In one approach, an integrated circuit as a power output stage with an output node, and a voltage regulator coupled to the power output stage. The voltage regulator selectively switches the power output stage into a current ramp down mode based on detection of a voltage surge at the output node. The power output stage has an associated current ramp down rate. The CPU is coupled to the output node and a surge notification input of the power output stage, where the power output stage accelerates the current ramp down based on a notification signal from the CPU.

Abstract translation: 向中央处理单元（CPU）提供电源的方法和系统提供增强的浪涌保护和增加的电池寿命。 在一种方法中，作为具有输出节点的功率输出级的集成电路和耦合到功率输出级的电压调节器。 电压调节器基于检测到输出节点处的电压浪涌，有选择地将功率输出级切换到电流斜坡下降模式。 功率输出级具有相关联的电流减速率。 CPU耦合到输出节点和功率输出级的浪涌通知输入，其中功率输出级基于来自CPU的通知信号来加速电流斜坡下降。

公开(公告)号：US20030072140A1

公开(公告)日：2003-04-17

申请号：US09977124

申请日：2001-10-12

Applicant: Intel Corporation

Inventor： Chee-Yee Chung ,  Robert L. Sankman ,  Alex Waizman

IPC: H05K007/06 ,  H05K003/30

CPC classification number: H05K1/167 ,  H01L23/50 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/095 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0317 ,  H05K2201/09309 ,  H05K2201/0949 ,  H05K2201/0979 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point connected to a capacitor terminal, a second contact point connected to a circuit board plane, and resistive material connected to the first and second contact points. The invention may also include a circuit board with one or more resistive elements, as well as a circuit package, such as an integrated circuit or a discrete bypass capacitor, including one or more resistive elements, applied to an outside surface. The value of resistance for the resistive element can be selected by design to have a predetermined relationship with the equivalent resistance of an associated circuit board and connecting circuitry.

Abstract translation: 描述了电阻元件，电路板和电路封装以及将电阻元件添加到电路板的方法。 电阻元件包括连接到电容器端子的第一接触点，连接到电路板平面的第二接触点和连接到第一和第二接触点的电阻材料。 本发明还可以包括具有一个或多个电阻元件的电路板，以及包括施加到外表面的一个或多个电阻元件的电路封装，例如集成电路或分立旁路电容器。 可以通过设计来选择电阻元件的电阻值以与相关联的电路板和连接电路的等效电阻具有预定的关系。