Invention Application
US20030102473A1 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate
审中-公开
用于制造半导体结构的结构和方法以及利用形成顺应性衬底的器件
- Patent Title: Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate
- Patent Title (中): 用于制造半导体结构的结构和方法以及利用形成顺应性衬底的器件
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Application No.: US09929024Application Date: 2001-08-15
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Publication No.: US20030102473A1Publication Date: 2003-06-05
- Inventor: Marc Chason , George Valliath , William J. Ooms
- Applicant: MOTOROLA, INC.
- Applicant Address: US IL Schaumburg
- Assignee: MOTOROLA, INC.
- Current Assignee: MOTOROLA, INC.
- Current Assignee Address: US IL Schaumburg
- Main IPC: H01L021/00
- IPC: H01L021/00 ; H01L029/12 ; H01L033/00 ; H01L029/76 ; H01L029/94 ; H01L031/062 ; H01L031/113 ; H01L031/119

Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying a monocrystalline layer of silicon formed on a low cost substrate, such as glass. The growth of the monocrystalline materials is accomplished by forming a compliant substrate for growing the monocrystalline materials. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon layer is taken care of by the amorphous interface layer.
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