The present invention describes a package method for a field emission display. First, a photolithography or a laser process is used to fix the location of the side glasses on the anode and cathode plates. Next, these side glasses are respectively bonded to the anode and cathode plates. Then, an alignment process is performed to generate a gap between the side glasses and the gap is filled with glass frits. Finally, the whole structure undergoes a thermal cycle to make the side glasses adhere to each other so that the anode plate and the cathode plate may be sealed.