Invention Application
US20030166342A1 Integrated method for release and passivation of MEMS structures
失效
MEMS结构的释放和钝化的集成方法
- Patent Title: Integrated method for release and passivation of MEMS structures
- Patent Title (中): MEMS结构的释放和钝化的集成方法
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Application No.: US10300970Application Date: 2002-11-20
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Publication No.: US20030166342A1Publication Date: 2003-09-04
- Inventor: Jeffrey D. Chinn , Rolf A. Guenther , Michael B. Rattner , James A. Cooper , Toi Yue Becky Leung
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: null
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: null
- Main IPC: H01L021/461
- IPC: H01L021/461 ; H01L021/31 ; H01L021/302 ; H01L021/469

Abstract:
Disclosed herein is a method of improving the adhesion of a hydrophobic self-assembled monolayer (SAM) coating to a surface of a MEMS structure, for the purpose of preventing stiction. The method comprises pretreating surfaces of the MEMS structure with a plasma generated from a source gas comprising oxygen and, optionally, hydrogen. The treatment oxidizes the surfaces, which are then reacted with hydrogen to form bonded OH groups on the surfaces. The hydrogen source may be present as part of the plasma source gas, so that the bonded OH groups are created during treatment of the surfaces with the plasma. Also disclosed herein is an integrated method for release and passivation of MEMS structures.
Public/Granted literature
- US06830950B2 Integrated method for release and passivation of MEMS structures Public/Granted day:2004-12-14
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