Invention Application
- Patent Title: Resin coated carrier fabrication method and the related apparatus for the fabrication
- Patent Title (中): 树脂涂层载体制造方法和相关的制造装置
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Application No.: US10238730Application Date: 2002-09-11
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Publication No.: US20040047991A1Publication Date: 2004-03-11
- Inventor: Ching-I Yu , Lang-Ching Chih , Kang-Tsun Liu , Kung-Ming Yen
- Applicant: S & S Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: S & S Technology Corp.
- Current Assignee: S & S Technology Corp.
- Current Assignee Address: TW Taoyuan
- Main IPC: B05D001/28
- IPC: B05D001/28 ; B05D005/10 ; B05C011/02 ; B05C001/00 ; B05D005/00

Abstract:
A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.
Information query