公开(公告)号：US20040047991A1

公开(公告)日：2004-03-11

申请号：US10238730

申请日：2002-09-11

Applicant: S & S Technology Corp.

Inventor： Ching-I Yu ,  Lang-Ching Chih ,  Kang-Tsun Liu ,  Kung-Ming Yen

IPC: B05D001/28 ,  B05D005/10 ,  B05C011/02 ,  B05C001/00 ,  B05D005/00

CPC classification number: B05C1/16 ,  B05C1/083 ,  B05C1/0834 ,  B05D1/28 ,  H05K3/0091 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0358 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/1545

Abstract: A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.

Abstract translation: 一种树脂涂布载体制造方法和相关装置，其中控制计量材料给料器以将粘合剂施加到经受预定厚度的连续旋转的材料转移滚筒的周边，同时载体带延伸超过印模 然后控制驱动机构以调整材料转移筒和压印滚筒之间的间隙，以使粘合剂能够转移到载体带上，在施加的粘合剂层周围留下空白区域 载体胶带。

公开(公告)号：US20040202834A1

公开(公告)日：2004-10-14

申请号：US10246531

申请日：2002-09-19

Applicant: S & S Technology Corp.

Inventor： Ching-I Yu ,  Lang-Ching Chih ,  Kang-Tsun Liu ,  Kung-Ming Yen

IPC: B32B003/00

CPC classification number: B32B15/09 ,  B32B7/04 ,  B32B15/20 ,  B32B27/08 ,  B32B27/36 ,  B32B2255/26 ,  B32B2457/08 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4673 ,  H05K2201/0358 ,  H05K2203/066 ,  H05K2203/068 ,  Y10T428/24802

Abstract: A resin-coated carrier having a sheet-like base, the sheet-like base corresponding to the shape of a PC board substrate on a relatively smaller scale, and a resin of a predetermined thickness covered over one side of the sheet-like base for bonding to a PC board substrate for making a PC board without causing an overflow of the resin.

Abstract translation: 具有片状基材的树脂涂布载体，相当于PC板基板的形状的片状基材以相对较小的尺寸，以及覆盖在片状基材的一面上的预定厚度的树脂， 结合到用于制造PC板的PC板基板，而不会引起树脂溢出。