- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US10756455申请日: 2004-01-14
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公开(公告)号: US20040147065A1公开(公告)日: 2004-07-29
- 发明人: Hidehito Kitakado , Ritsuko Kawasaki , Kenji Kasahara
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Atsugi-shi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP11-099481 19990406; JP11-176120 19990622
- 主分类号: H01L021/00
- IPC分类号: H01L021/00 ; H01L021/84
摘要:
The present invention provides a semiconductor device in which a bottom-gate TFT or an inverted stagger TFT arranged in each circuit is suitably constructed in conformity with the functionality of the respective circuits, thereby attaining an improvement in the operating efficiency and reliability of the semiconductor device. In the structure, LDD regions in a pixel TFT are arranged so as not to overlap with a channel protection insulating film and to overlap with a gate electrode by at least a portion thereof. LDD regions in an N-channel TFT of a drive circuit is arranged so as not to overlap with a channel protection insulating film and to overlap with a gate electrode by at least a portion thereof. LDD regions in a P-channel TFT of the drive circuit is arranged so as to overlap with a channel protection insulating film and to overlap with the gate electrode.
公开/授权文献
- US07176068B2 Semiconductor device and manufacturing method thereof 公开/授权日:2007-02-13
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