Semiconductor device and method for manufacturing same
    2.
    发明申请
    Semiconductor device and method for manufacturing same 有权
    半导体装置及其制造方法

    公开(公告)号:US20040201023A1

    公开(公告)日:2004-10-14

    申请号:US10835077

    申请日:2004-04-30

    摘要: An object is to enhance the orientation ratio of a crystalline semiconductor film obtained by crystallizing an amorphous semiconductor film while using as a substrate a less-heat-resistive material such as glass thereby. providing a semiconductor device using a crystalline semiconductor film with high quality equivalent to a single crystal. A first crystalline semiconductor film and a second crystalline semiconductor film are formed overlying a substrate, which integrally structure a crystalline semiconductor layer. The first and second crystalline semiconductor films are polycrystalline bodies aggregated with a plurality of crystal grains. However, the crystal grains are aligned toward a (101)-plane orientation at a ratio of 30 percent or greater, preferably 80 percent or greater. Also, relying on a plane orientation of the crystal grains in the first crystalline semiconductor film, the second crystalline semiconductor film has a plane orientation also aligned in the same direction with a probability of 60 percent or higher.

    摘要翻译: 目的是提高通过使非晶半导体膜结晶获得的结晶半导体膜的取向比,同时使用诸如玻璃之类的耐热性较差的材料作为基板。 提供使用具有与单晶相当的高质量的晶体半导体膜的半导体器件。 第一晶体半导体膜和第二晶体半导体膜形成在基板上,其一体地结构化结晶半导体层。 第一和第二晶体半导体膜是与多个晶粒聚集的多晶体。 然而,晶粒以30%或更大,优选80%或更大的比例朝向(101)面平面取向。 此外,依靠第一结晶半导体膜中的晶粒的平面取向,第二结晶半导体膜的面取向也以相同方向排列,概率为60%以上。

    Semiconductor device and method of fabricating the same
    3.
    发明申请
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20040140470A1

    公开(公告)日:2004-07-22

    申请号:US10625904

    申请日:2003-07-24

    IPC分类号: H01L029/04 H01L021/00

    摘要: A crystalline semiconductor film in which the position and size of a crystal grain is controlled is fabricated, and the crystalline semiconductor film is used for a channel formation region of a TFT, so that a high performance TFT is realized. An island-like semiconductor layer is made to have a temperature distribution, and a region where temperature change is gentle is provided to control the nucleus generation speed and nucleus generation density, so that the crystal grain is enlarged. In a region where an island-like semiconductor layer 1003 overlaps with a base film 1002, a thick portion is formed in the base film 1002. The volume of this portion increases and heat capacity becomes large, so that a cycle of temperature change by irradiation of a pulse laser beam to the island-like semiconductor layer becomes gentle (as compared with other thin portion). Like this, a laser beam is irradiated from the front side and reverse side of the substrate to directly heat the semiconductor layer, and heat conduction from the semiconductor layer to the side of the substrate and heat conduction of the semiconductor layer in the horizontal direction to the substrate are used, so that the increase in the size of the crystal grain is realized.

    摘要翻译: 制造其中晶体的位置和尺寸被控制的结晶半导体膜,并且晶体半导体膜用于TFT的沟道形成区域,从而实现高性能TFT。 使岛状半导体层具有温度分布,并且设置温度变化缓慢的区域以控制核产生速度和核产生密度,使得晶粒增大。 在岛状半导体层1003与基膜1002重叠的区域中,在基膜1002中形成厚部。该部分的体积增加,热容变大,使得通过照射的温度变化的周期 脉冲激光束到岛状半导体层变得平缓(与其他薄部分相比)。 像这样,从基板的正面侧和反面侧照射激光束,直接加热半导体层,从半导体层向基板侧的热传导,将半导体层沿水平方向的热传导到 使用基板,从而实现晶粒尺寸的增加。

    Semiconductor device and a method of manufacturing the same
    5.
    发明申请
    Semiconductor device and a method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20040248387A1

    公开(公告)日:2004-12-09

    申请号:US10653883

    申请日:2003-09-04

    摘要: To provide a TFT that can operate at a high speed by forming a crystalline semiconductor film while controlling the position and the size of a crystal grain in the film to use the crystalline semiconductor film for a channel forming region of the TFT. Instead of a metal or a highly heat conductive insulating film, only a conventional insulating film is used as a base film to introduce a temperature gradient. A level difference of the base insulating film is provided in a desired location to generate the temperature distribution in the semiconductor film in accordance with the arrangement of the level difference. The starting point and the direction of lateral growth are controlled utilizing the temperature distribution.

    摘要翻译: 为了提供可以通过在控制晶片的晶粒的位置和尺寸的同时,通过形成晶体半导体膜来高速操作的TFT,以使用用于TFT的沟道形成区域的晶体半导体膜。 代替金属或高导热绝缘膜,仅使用传统的绝缘膜作为基膜来引入温度梯度。 基底绝缘膜的电平差设置在所需位置,以根据电平差的布置在半导体膜中产生温度分布。 利用温度分布来控制侧向生长的起点和方向。

    Semiconductor device and method of fabricating thereof

    公开(公告)号:US20040063258A1

    公开(公告)日:2004-04-01

    申请号:US10678084

    申请日:2003-10-06

    IPC分类号: H01L021/00

    摘要: To realize TFT enabling high-speed operation by fabricating a crystalline semiconductor film in which positions and sizes of crystal grains are controlled and using the crystalline semiconductor film in a channel forming region of TFT, a film thickness is stepped by providing a stepped difference in at least one layer of a matrix insulating film among a plurality of matrix insulating films having refractive indices different from each other. By irradiating laser beam from a rear face side of a substrate (or both sides of a surface side and the rear face side of the substrate), there is formed an effective intensity distribution of laser beam with regard to a semiconductor film and there is produced a temperature gradient in correspondence with a shape of the stepped difference and a distribution of the film thickness of the matrix insulating film in the semiconductor film. By utilizing thereof, a location of producing lateral growth and a direction thereof can be controlled to thereby enable to provide crystal grains having large particle sizes.

    Semiconductor device and method of manufacturing the same
    9.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20020197778A1

    公开(公告)日:2002-12-26

    申请号:US10141451

    申请日:2002-05-08

    IPC分类号: H01L021/00 H01L021/84

    摘要: The sizes of crystal masses are made to be a uniform in a crystalline silicon film obtained by a thermal crystallization method in which a metal element is used. An amorphous silicon film to be crystallized is doped with a metal element that accelerates crystallization, and then irradiated with laser light (with an energy which is not large enough to melt the film and which is large enough to allow the metal element to diffuse in the solid silicon film) from the back side of a light-transmissive substrate. Thereafter, heat treatment is performed to obtain a crystalline silicon film. Thus crystal masses in the crystalline silicon film can have a uniform size and the problem of fluctuation between TFTs can be solved.

    摘要翻译: 在通过使用金属元素的热结晶法获得的结晶硅膜中,使晶体的尺寸均匀。 要结晶的非晶硅膜掺杂有加速结晶的金属元素,然后用激光(具有不足够的能量熔化膜并且足够大以使金属元素在 固体硅膜)从透光性基板的背面侧。 之后,进行热处理,得到结晶硅膜。 因此,晶体硅膜中的晶体质量可以具有均匀的尺寸,并且可以解决TFT之间的波动问题。

    Laser beam irradiation method and method of manufacturing a thin film transistor
    10.
    发明申请
    Laser beam irradiation method and method of manufacturing a thin film transistor 有权
    激光束照射方法及制造薄膜晶体管的方法

    公开(公告)号:US20040248347A1

    公开(公告)日:2004-12-09

    申请号:US10883767

    申请日:2004-07-06

    IPC分类号: H01L021/00 H01L021/84

    摘要: A laser beam irradiation method that achieves uniform crystallization, even if a film thickness of an a-Si film or the like fluctuates, is provided. The present invention provides a laser beam irradiation method in which a non-single crystal semiconductor film is formed on a substrate having an insulating surface and a laser beam having a wavelength longer than 350 nm is irradiated to the non-single crystal semiconductor film, thus crystallizing the non-single crystal silicon film. The non-single crystal semiconductor film has a film thickness distribution within the surface of the substrate, and a differential coefficient of a laser beam absorptivity with respect to the film thickness of the non-single crystal semiconductor film is positive.

    摘要翻译: 即使a-Si膜的膜厚等发生波动,也能够实现均匀结晶化的激光束照射方法。 本发明提供一种激光束照射方法,其中在具有绝缘面的基板上形成非单晶半导体膜,并且将具有波长超过350nm的激光束照射到非单晶半导体膜上,因此 使非单晶硅膜结晶。 非单晶半导体膜在基板的表面内具有膜厚分布,并且相对于非单晶半导体膜的膜厚度的激光束吸收率的微分系数为正。