发明申请
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US10878654申请日: 2004-06-29
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公开(公告)号: US20050006648A1公开(公告)日: 2005-01-13
- 发明人: Shunpei Yamazaki , Ryoji Nomura , Hiroko Abe , Mikio Yukawa , Yasuyuki Arai
- 申请人: Shunpei Yamazaki , Ryoji Nomura , Hiroko Abe , Mikio Yukawa , Yasuyuki Arai
- 优先权: JP2003-187601 20030630
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L27/32 ; H01L31/16 ; H01L51/50 ; H01L51/52 ; H01S5/30 ; H01L29/04
摘要:
The present invention provides a semiconductor device having an integrated circuit formed by a low cost glass substrate, which can respond to the increase of an amount of information, and which offers high performance at high speed. A semiconductor device comprises a plurality of glass substrates respectively provided with a circuit including a semiconductor element, in which each of the plurality of glass substrates has both or either of a light-emitting element and/or a light-receiving element; wherein the light-emitting element is formed to have an electroluminescent layer interposed between a pair of electrodes, in which the electroluminescent layer is formed by stacking a plurality of layers capable of emitting light each other so that laser light is oscillated upon applying current to the electroluminescent layer; and a signal is transmitted among circuits formed over the plurality of glass substrates by generating a light signal using the laser light oscillated from the light-emitting element and converting the light signal into an electrical signal in the light-receiving element.
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