发明申请
- 专利标题: Method for fabricating semiconductor device
- 专利标题(中): 制造半导体器件的方法
-
申请号: US10882357申请日: 2004-07-02
-
公开(公告)号: US20050014339A1公开(公告)日: 2005-01-20
- 发明人: Kouichi Tani , Osamu Yamaguchi
- 申请人: Kouichi Tani , Osamu Yamaguchi
- 优先权: JP198333/2003 20030717
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/3213 ; H01L21/8234 ; H01L21/84 ; H01L27/08 ; H01L27/088 ; H01L27/10 ; H01L27/12 ; H01L29/417 ; H01L29/786 ; H01L29/74 ; H01L31/111
摘要:
A method for fabricating a semiconductor device in which plural transistors including a first transistor and a second transistor are integrated includes a first step for forming the first transistor such that a distance between a drain contact and a gate electrode of the first transistor is a fist distance, and a second step for forming the second transistor such that a distance between a drain contact and a gate electrode of the second transistor is a second distance larger than the first distance.
公开/授权文献
- US07220638B2 Method for fabricating semiconductor device 公开/授权日:2007-05-22
信息查询
IPC分类: