Invention Application
- Patent Title: Methods of forming silicide films in semiconductor devices
- Patent Title (中): 在半导体器件中形成硅化物膜的方法
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Application No.: US10866643Application Date: 2004-06-10
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Publication No.: US20050017310A1Publication Date: 2005-01-27
- Inventor: Ernst Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius van der Jeugd
- Applicant: Ernst Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius van der Jeugd
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/24 ; H01L21/285 ; H01L21/336 ; H01L21/8234 ; H01L27/088 ; H01L29/78 ; H01L29/76

Abstract:
A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.
Public/Granted literature
- US07153772B2 Methods of forming silicide films in semiconductor devices Public/Granted day:2006-12-26
Information query
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