Invention Application
- Patent Title: MEMS having a three-wafer structure
- Patent Title (中): 具有三晶片结构的MEMS
-
Application No.: US10630769Application Date: 2003-07-31
-
Publication No.: US20050023547A1Publication Date: 2005-02-03
- Inventor: Peter Hartwell , Storrs Hoen , David Horsley , Chung Ching Yang , Paul Merchant , Carl Taussig , Gail O'Neill-Merchant
- Applicant: Peter Hartwell , Storrs Hoen , David Horsley , Chung Ching Yang , Paul Merchant , Carl Taussig , Gail O'Neill-Merchant
- Main IPC: G01P15/125
- IPC: G01P15/125 ; B81B3/00 ; B81B5/00 ; B81B7/00 ; B81B7/02 ; H01L29/82 ; H01L33/00
Abstract:
A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.
Public/Granted literature
- US06930368B2 MEMS having a three-wafer structure Public/Granted day:2005-08-16
Information query
IPC分类:
