发明申请
- 专利标题： Stacked memory and manufacturing method thereof
- 专利标题（中）： 堆叠式存储器及其制造方法
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申请号： US10901168申请日： 2004-07-29
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公开(公告)号： US20050023668A1公开(公告)日： 2005-02-03
- 发明人: Nobuaki Ebihara , Naoshi Suzuki
- 申请人： Nobuaki Ebihara , Naoshi Suzuki
- 专利权人： NEC TOSHIBA Space Systems, Ltd.
- 当前专利权人： NEC TOSHIBA Space Systems, Ltd.
- 优先权： JP2003-283598 20030731
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L25/10 ; H01L25/11 ; H05K1/14 ; H05K3/32 ; H05K3/34 ; H01L23/02
摘要：
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.
公开/授权文献
- US07145227B2 Stacked memory and manufacturing method thereof 公开/授权日：2006-12-05
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