公开(公告)号：US20050023668A1

公开(公告)日：2005-02-03

申请号：US10901168

申请日：2004-07-29

申请人： Nobuaki Ebihara ,  Naoshi Suzuki

发明人： Nobuaki Ebihara ,  Naoshi Suzuki

IPC分类号： H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H01L23/02

CPC分类号： H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

摘要： To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

摘要翻译： 为了将TSOP安装在插入物基板上，通过热固性导电树脂将提供给TSOP的引线接合到插入器基板的焊盘，并且引线之外的TSOP通过热固性导电树脂与形成在插入器基板中的接地层接合 。 将其上安装有TSOP的插入物基板以使得TSOP面向下的方式以8层层叠。 然后，通过热固性导电树脂将上部插入器基板的引线接合到形成在下部插入器基板的后表面中的焊盘，使得在垂直方向上相邻的插入器基板被连接。

公开(公告)号：US20070004089A1

公开(公告)日：2007-01-04

申请号：US11517366

申请日：2006-09-08

申请人： Nobuaki Ebihara ,  Naoshi Suzuki

发明人： Nobuaki Ebihara ,  Naoshi Suzuki

IPC分类号： H01L21/58 ,  H01L21/60

CPC分类号： H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

摘要： To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

摘要翻译： 为了将TSOP安装在插入物基板上，通过热固性导电树脂将提供给TSOP的引线接合到插入器基板的焊盘，并且引线之外的TSOP通过热固性导电树脂与形成在插入器基板中的接地层接合 。 将其上安装有TSOP的插入物基板以使得TSOP面向下的方式以8层层叠。 然后，通过热固性导电树脂将上部插入器基板的引线接合到形成在下部插入器基板的后表面中的焊盘，使得在垂直方向上相邻的插入器基板被连接。

公开(公告)号：US07432131B2

公开(公告)日：2008-10-07

申请号：US11517366

申请日：2006-09-08

申请人： Nobuaki Ebihara ,  Naoshi Suzuki

发明人： Nobuaki Ebihara ,  Naoshi Suzuki

IPC分类号： H01L29/74

CPC分类号： H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

摘要： To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

摘要翻译： 为了将TSOP安装在插入物基板上，通过热固性导电树脂将提供给TSOP的引线接合到插入器基板的焊盘，并且引线之外的TSOP通过热固性导电树脂与形成在插入器基板中的接地层接合 。 将其上安装有TSOP的插入物基板以使得TSOP面向下的方式以8层层叠。 然后，通过热固性导电树脂将上部插入器基板的引线接合到形成在下部插入器基板的后表面中的焊盘，使得在垂直方向上相邻的插入器基板被连接。

公开(公告)号：US07145227B2

公开(公告)日：2006-12-05

申请号：US10901168

申请日：2004-07-29

申请人： Nobuaki Ebihara ,  Naoshi Suzuki

发明人： Nobuaki Ebihara ,  Naoshi Suzuki

IPC分类号： H01L23/48

CPC分类号： H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

摘要： To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

摘要翻译： 为了将TSOP安装在插入物基板上，通过热固性导电树脂将提供给TSOP的引线接合到插入器基板的焊盘，并且引线之外的TSOP通过热固性导电树脂与形成在插入器基板中的接地层接合 。 将其上安装有TSOP的插入物基板以使得TSOP面向下的方式以8层层叠。 然后，通过热固性导电树脂将上部插入器基板的引线接合到形成在下部插入器基板的后表面中的焊盘，使得在垂直方向上相邻的插入器基板被连接。