发明申请
- 专利标题： Method and apparatus for detecting wafer flaw
- 专利标题（中）： 检测晶圆缺陷的方法和装置
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申请号： US10633414申请日： 2003-08-04
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公开(公告)号： US20050028594A1公开(公告)日： 2005-02-10
- 发明人: Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
- 申请人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
- 主分类号： G01N29/07
- IPC分类号： G01N29/07 ; G01N29/22 ; G01N29/44 ; G01N29/04
摘要：
The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.
公开/授权文献
- US06941811B2 Method and apparatus for detecting wafer flaw 公开/授权日：2005-09-13
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