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    Wafer cleaning apparatus with multiple wash-heads
    1.
    发明授权
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号：US07252099B2

    公开(公告)日：2007-08-07

    申请号：US10655224

    申请日：2003-09-05

    申请人： Chih-Kun Chen ,  Yao-Hsiung Kung

    发明人： Chih-Kun Chen ,  Yao-Hsiung Kung

    IPC分类号： B08B3/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

    摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译： 在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外，旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置，可以完全驱动旋转模块。 此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

    Wafer cleaning apparatus with multiple wash-heads
    6.
    发明申请
    Wafer cleaning apparatus with multiple wash-heads 有权
    具有多个洗头的晶圆清洗设备

    公开(公告)号：US20050051200A1

    公开(公告)日：2005-03-10

    申请号：US10655224

    申请日：2003-09-05

    申请人： Chih-Kun Chen ,  Yao-Hsiung Kung

    发明人： Chih-Kun Chen ,  Yao-Hsiung Kung

    IPC分类号： B08B3/02 ,  H01L21/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

    摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

    摘要翻译： 在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。 晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。 旋转模块也包括在晶片清洁装置中。 旋转模块的顶侧与驱动装置连接。 此外，旋转模块包括多个洗头和至少一个喷嘴。 这里的洗头的底部与晶片的表面接触。 通过使用驱动装置，可以完全驱动旋转模块。 此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。 流体从喷嘴和助剂喷射通过流体管清洁晶片。 单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。