Invention Application
- Patent Title: Memory module including an integrated circuit device
- Patent Title (中): 内存模块包括集成电路设备
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Application No.: US10939501Application Date: 2004-09-14
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Publication No.: US20050030802A1Publication Date: 2005-02-10
- Inventor: Michael Farmwald , Mark Horowitz
- Applicant: Michael Farmwald , Mark Horowitz
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Main IPC: G06F1/10
- IPC: G06F1/10 ; G06F11/00 ; G06F11/10 ; G06F12/00 ; G06F12/02 ; G06F12/06 ; G06F13/16 ; G06F13/376 ; G11C5/00 ; G11C5/06 ; G11C7/10 ; G11C7/22 ; G11C8/00 ; G11C11/401 ; G11C11/407 ; G11C11/4076 ; G11C11/409 ; G11C11/4096 ; G11C29/00

Abstract:
The present invention includes a memory subsystem comprising at least two semiconductor devices, including at least one memory device, connected to a bus, where the bus includes a plurality of bus lines for carrying substantially all address, data and control information needed by said memory devices, where the control information includes device-select information and the bus has substantially fewer bus lines than the number of bits in a single address, and the bus carries device-select information without the need for separate device-select lines connected directly to individual devices. The present invention also includes a protocol for master and slave devices to communicate on the bus and for registers in each device to differentiate each device and allow bus requests to be directed to a single or to all devices. The present invention includes modifications to prior-art devices to allow them to implement the new features of this invention. In a preferred implementation, 8 bus data lines and an AddressValid bus line carry address, data and control information for memory addresses up to 40 bits wide.
Public/Granted literature
- US07110322B2 Memory module including an integrated circuit device Public/Granted day:2006-09-19
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