Invention Application
US20050032357A1 Dielectric materials and methods for integrated circuit applications
审中-公开
用于集成电路应用的介质材料和方法
- Patent Title: Dielectric materials and methods for integrated circuit applications
- Patent Title (中): 用于集成电路应用的介质材料和方法
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Application No.: US10886061Application Date: 2004-07-08
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Publication No.: US20050032357A1Publication Date: 2005-02-10
- Inventor: Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
- Applicant: Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
- Main IPC: G01N27/00
- IPC: G01N27/00
Abstract:
An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.
Public/Granted literature
- US3220185A Transmission Public/Granted day:1965-11-30
Information query
