发明申请
US20050032357A1 Dielectric materials and methods for integrated circuit applications
审中-公开
用于集成电路应用的介质材料和方法
- 专利标题： Dielectric materials and methods for integrated circuit applications
- 专利标题（中）： 用于集成电路应用的介质材料和方法
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申请号： US10886061申请日： 2004-07-08
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公开(公告)号： US20050032357A1公开(公告)日： 2005-02-10
- 发明人: Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
- 申请人： Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
- 主分类号： G01N27/00
- IPC分类号： G01N27/00
摘要：
An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.
公开/授权文献
- US3220185A Transmission 公开/授权日：1965-11-30
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