发明申请
- 专利标题: Semiconductor light emitting device and fabrication method thereof
- 专利标题(中): 半导体发光器件及其制造方法
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申请号: US10962025申请日: 2004-10-08
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公开(公告)号: US20050045894A1公开(公告)日: 2005-03-03
- 发明人: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Toyoharu Oohata
- 申请人: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Toyoharu Oohata
- 优先权: JPP2000-381249 20001215
- 主分类号: H01L21/205
- IPC分类号: H01L21/205 ; H01L33/16 ; H01L33/24 ; H01L33/32 ; H01S5/323 ; H01L33/00
摘要:
Semiconductor light emitting devices and methods of producing same are provided. The semiconductor light emitting devices include a substrate that has a surface including a difference-in-height portion composed of, for example, a wurtzite compound. A crystal growth layer is formed in the substrate surface wherein at least a portion of which is oriented along an inclined plane with respect to a principal plane of the substrate. The semiconductor device includes a first conductive layer, an active layer and a second conductive layer formed on the crystal layer in a stacked arrangement and oriented along the inclined place.
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