发明申请
- 专利标题： Vacuum processing apparatus
- 专利标题（中）： 真空加工设备
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申请号： US10812086申请日： 2004-03-30
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公开(公告)号： US20050051092A1公开(公告)日： 2005-03-10
- 发明人: Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
- 申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; H01L21/00
摘要：
A vacuum processing apparatus including a transfer chamber inside of which an object wafer to be processed is transferred, and two processing chambers disposed outside of the transfer chamber and attached to the transfer chamber in a detachable manner. The inside of each processing chamber is decompressed so as to process the wafer being placed therein using a plasma generated from a processing gas supplied thereto, and two supply units supply the processing gas to the two processing chambers, respectively. The two supply units are disposed vertically outside of the transfer chamber and between the two processing chambers.
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