发明申请
- 专利标题： ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT
- 专利标题（中）： 具有热分离支持的电子组件
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申请号： US10676546申请日： 2003-09-30
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公开(公告)号： US20050067178A1公开(公告)日： 2005-03-31
- 发明人: Tom Pearson , Terry Dishongh , Damion Searls
- 申请人： Tom Pearson , Terry Dishongh , Damion Searls
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/40 ; H01L23/42 ; H05K3/34 ; H05K13/04 ; H01L23/02 ; H02G3/00
摘要：
According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.
公开/授权文献
- US06903271B2 Electronic assembly with thermally separated support 公开/授权日：2005-06-07
信息查询
IPC分类:
