发明申请
- 专利标题: Hybrid integrated circuit device and method of manufacturing the same
- 专利标题(中): 混合集成电路装置及其制造方法
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申请号: US10941076申请日: 2004-09-15
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公开(公告)号: US20050067186A1公开(公告)日: 2005-03-31
- 发明人: Masahiko Mizutani , Mitsuru Noguchi , Nobuhisa Takakusaki
- 申请人: Masahiko Mizutani , Mitsuru Noguchi , Nobuhisa Takakusaki
- 申请人地址: JP Moriguchi-city
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Moriguchi-city
- 优先权: JP2003-333888 20030925
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H01L21/84 ; H01L23/13 ; H01L25/16 ; H01L27/12 ; H05K1/00 ; H05K1/05 ; H05K3/00 ; H05K3/28 ; H05K3/46 ; H05K7/02
摘要:
An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.