发明申请
- 专利标题： Substrate processing apparatus and substrate processing method
- 专利标题（中）： 基板加工装置及基板处理方法
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申请号： US10712348申请日： 2003-11-14
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公开(公告)号： US20050072358A1公开(公告)日： 2005-04-07
- 发明人: Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
- 申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
- 优先权： JP2002-332944 20021115; JP2003-016727 20030124; JP2003-061368 20030307; JP2003-067211 20030312; JP2003-072328 20030317; JP2003-146641 20030523
- 主分类号： C23C18/16
- IPC分类号： C23C18/16 ; C25D7/12 ; C25D17/00 ; H01L21/00 ; H01L21/677 ; H01L21/687 ; C23C16/00
摘要：
The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate, wherein the loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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