发明申请
US20050081534A1 Cooling device and electronic apparatus building in the same 审中-公开
冷却装置与电子设备相同

Cooling device and electronic apparatus building in the same
摘要:
In a liquid cooling system of low costs and being installable with high density into a server having a several kinds of predetermined heights of housings, each of devices building up the liquid cooling system is set to be within about 44 mm, being the standard height of a lack when installing into a cabinet for the server lack of lack-mount method, in particular, about from 40 mm to 36 mm, and this is combined with, thereby building up a liquid cooling system of low costs and enabling high density installation, for an electronic apparatus of lack-mount method having different heights.
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