发明申请
- 专利标题: Apparatus for electroless deposition
- 专利标题(中): 无电沉积装置
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申请号: US10965220申请日: 2004-10-14
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公开(公告)号: US20050081785A1公开(公告)日: 2005-04-21
- 发明人: Dmitry Lubomirsky , Arulkumar Shanmugasundram , Ian Pancham , Sergey Lopatin
- 申请人: Dmitry Lubomirsky , Arulkumar Shanmugasundram , Ian Pancham , Sergey Lopatin
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 主分类号: B05C3/00
- IPC分类号: B05C3/00 ; B05C19/02 ; C23C18/16 ; C23C18/28 ; C23F1/00 ; C25D7/12 ; H01L21/288 ; H01L21/768
摘要:
Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.
公开/授权文献
- US07341633B2 Apparatus for electroless deposition 公开/授权日:2008-03-11