发明申请
- 专利标题： Semiconductor device and method for manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
-
申请号： US11006664申请日： 2004-12-08
-
公开(公告)号： US20050082684A1公开(公告)日： 2005-04-21
- 发明人: Kazuyuki Aiba , Akira Takashima , Kaname Ozawa , Tetsuya Hiraoka , Takaaki Suzuki , Yasurou Matsuzaki
- 申请人： Kazuyuki Aiba , Akira Takashima , Kaname Ozawa , Tetsuya Hiraoka , Takaaki Suzuki , Yasurou Matsuzaki
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/31 ; H01L23/433 ; H01L25/065 ; H01L27/118 ; H01L29/06 ; H01L21/48 ; H01L23/52
摘要：
A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.
公开/授权文献
- US07138723B2 Deformable semiconductor device 公开/授权日：2006-11-21
信息查询
IPC分类:
