发明申请
- 专利标题： Wafer bonded virtual substrate and method for forming the same
- 专利标题（中）： 晶圆粘结虚拟基板及其形成方法
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申请号： US11004948申请日： 2004-12-07
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公开(公告)号： US20050085049A1公开(公告)日： 2005-04-21
- 发明人: Harry Atwater , James Zahler , Anna Morral
- 申请人： Harry Atwater , James Zahler , Anna Morral
- 专利权人： CALIFORNIA INSTITUTE OF TECHNOLOGY
- 当前专利权人： CALIFORNIA INSTITUTE OF TECHNOLOGY
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/18 ; H01L21/30 ; H01L21/302 ; H01L21/46 ; H01L21/461 ; H01L21/76 ; H01L31/0328 ; H01L31/0392 ; H01L31/109 ; H01L31/18
摘要：
A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which, serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.
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